项目                               分析纯  
                                    (AR)
含量(Cu)Assay,%                    ≥ 99.5
硝酸不溶物Insoluble matter,%                 ≤ 0.01
硫化氢沉淀物Snbstances not prec-
ipitated by hydrogen sulfide,%               ≤ 0.04
铁(Fe)Iron,%                                 ≤ 0.01
砷(As)Arsenic,%                              ≤ 0.001
银(Ag)silver,%                               ≤ 0.002
锑和锡(以Sn计)Antimony and tin,%             ≤ 0.01
铅(Pb)Lead,%                                 ≤ 0.01


4N,99.99%
外观Appearance                              Copper-colored powder
X射线衍射X-ray diffraction                  Conforms to standard
纯度Purity (complexometric titration)       98-102 %
ICP Assay                                   Confirms copper component
痕量金属Trace analysis, ICP                 ≤100 ppm
纯度Purity(metal basis)                     ≥99.99 %
                        

99.9%，D50(0.2～0.55μm)
外观Appearance                              Copper-colored powder
X射线衍射X-ray diffraction                  Conforms to standard
纯度Purity (complexometric titration)       98-102 %
ICP Assay                                   Confirms copper component
痕量金属Trace analysis, ICP                 ≤1000 ppm
纯度Purity(metal basis)                     ≥99.9 %
平均粒度Particle size, D50                  0.2 - 0.55 μm


99.9%，D50(0.6～1.0μm)
外观Appearance                              Copper-colored powder
X射线衍射X-ray diffraction                  Conforms to standard
纯度Purity (complexometric titration)       98-102 %
ICP Assay                                   Confirms copper component
痕量金属Trace analysis, ICP                 ≤1000 ppm
纯度Purity(metal basis)                     ≥99.9 %
平均粒度Particle size, D50                  0.6～1.0μm


99.9%，D50(1.0～3.0μm)
外观Appearance                              Copper-colored powder
X射线衍射X-ray diffraction                  Conforms to standard
纯度Purity (complexometric titration)       98-102 %
ICP Assay                                   Confirms copper component
痕量金属Trace analysis, ICP                 ≤1000 ppm
纯度Purity(metal basis)                     ≥99.9 %
平均粒度Particle size, D50                  1.0～3.0μm


99.9%，10-30nm
外观Appearance                              Copper-colored powder
X射线衍射X-ray diffraction                  Conforms to standard
纯度Purity (complexometric titration)       98-102 %
ICP Assay                                   Confirms copper component
痕量金属Trace analysis, ICP                 ≤1000 ppm
纯度Purity(metal basis)                     ≥99.9 %
平均粒度Particle size                       10-30nm


99.9%，80-100nm
外观Appearance                              Copper-colored powder
X射线衍射X-ray diffraction                  Conforms to standard
纯度Purity (complexometric titration)       98-102 %
ICP Assay                                   Confirms copper component
痕量金属Trace analysis, ICP                 ≤1000 ppm
纯度Purity(metal basis)                     ≥99.9 %
平均粒度Particle size                       80-100nm